Definition
Superconformal electrodeposition in which a recessed feature fills preferentially from the bottom upward rather than by uniform growth on all surfaces.
Application
Used to fill copper damascene trenches and vias for chip interconnects while limiting seam and void formation.
Related search terms
Superconformal Filling; Superfilling
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/modeling-superconformal-electrodeposition-using-level-set-method
- Evidence from research.ibm.comhttps://research.ibm.com/publications/damascene-copper-electroplating-for-chip-interconnections