Definition
A conductive metal fill formed inside a contact opening to create a vertical electrical path between a transistor or semiconductor region and the local or back-end interconnect above it.
Application
Used in middle-of-line contact formation after contact etch. Tungsten has historically been widely used because it can fill narrow contact holes conformally, while newer schemes may use selective tungsten, cobalt or molybdenum to lower resistance at advanced nodes.
Related search terms
Contact fill; tungsten contact plug (common implementation)
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Related concepts
Evidence and further reading
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/product-library/endura-volta-selective-w-cvd.html
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/newsroom/blogs/cooptimized-process-metrology-accelerates-molybdenum-contact-development.html