Definition
A thin film inserted between adjacent materials to suppress unwanted diffusion, chemical reaction, intermixing or interface degradation during fabrication and operation.
Application
Used throughout semiconductor integration, especially in BEOL metallization, to keep copper or other conductors from diffusing into nearby dielectrics and to preserve interface reliability as dimensions shrink.
Related search terms
Diffusion-barrier layer; barrier film
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Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/imec-magazine/imec-magazine-september-2017/how-to-solve-the-back-end-of-line-rc-delay-problem
- Evidence from appliedmaterials.comhttps://www.appliedmaterials.com/us/en/semiconductor/solutions-and-software/software-solutions/ace-plus-suite/feature-scale.html