Definition
A bonding method in which two sufficiently clean, smooth and prepared surfaces are brought into direct contact and joined through interfacial attraction and subsequent bond strengthening without a conventional adhesive or solder layer.
Application
Used for engineered substrates, layer transfer, MEMS, image sensors and 3D integration; surface cleaning and activation, planarity, particle control, alignment and annealing determine bond quality, and hybrid bonding extends direct dielectric bonding with embedded metal interconnects.
Related search terms
Fusion bonding; molecular bonding; adhesive-free direct bonding
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Related concepts
Evidence and further reading
- Evidence from evgroup.comhttps://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems
- Evidence from evgroup.comhttps://www.evgroup.com/index.php?L=5&id=30