Definition
The assembly process of accurately placing and joining a semiconductor die to a package substrate, leadframe, wafer or another die using an appropriate bonding method.
Application
Used for pick-and-place die attach, flip-chip and stacked-die or heterogeneous-integration assembly; placement accuracy, alignment, bonding material or interface, force and temperature are selected for the interconnect and package architecture.
Related search terms
Chip bonding; die placement and bonding
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Related concepts
Evidence and further reading
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/die-bonding-process-for-placing-a-chip-on-a-package-substrate/
- Evidence from indium.comhttps://www.indium.com/applications/semiconductor-packaging-and-assembly/die-attach/