Definition
An individual semiconductor chip containing a fabricated circuit or device, defined on a wafer and intended to be separated from that wafer for test, assembly or packaging.
Application
Used as the functional chip unit in semiconductor packaging; acceptable dies may be picked from dicing tape and attached, wire-bonded, flip-chip bonded, stacked or integrated with other dies in advanced packages.
Related search terms
Semiconductor die; chip; bare die
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Related concepts
Evidence and further reading
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/singulation-the-moment-when-a-wafer-is-separated-into-multiple-semiconductor-chips/
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/die-bonding-process-for-placing-a-chip-on-a-package-substrate/