Definition
A thin substrate, typically disk-shaped, used in semiconductor manufacturing, including for device fabrication, process or equipment testing, or as a processing carrier.
Application
Provides a base for semiconductor-device fabrication; carrier wafers can be temporarily bonded to device wafers during processing.
Related concepts
Evidence and further reading
- Evidence from semi.orghttps://www.semi.org/sites/semi.org/files/2023-12/CompilationTerms1023.pdf
- Evidence from siltronic.comhttps://www.siltronic.com/en/products.html