Definition
The singulation process that separates a processed semiconductor wafer into individual dies, using methods such as blade sawing, laser-based separation or other controlled cutting techniques.
Application
Used after wafer processing and typically after wafer test and thinning to produce individual chips for assembly; dicing method, tape support and process conditions are controlled to limit chipping, cracking, kerf damage and contamination.
Related search terms
Wafer dicing; die singulation; wafer singulation
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Related concepts
Evidence and further reading
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/singulation-the-moment-when-a-wafer-is-separated-into-multiple-semiconductor-chips/
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/semiconductor-back-end-process-episode-6-conventional-packages/