Definition
A precision singulation tool that uses a high-speed, thin abrasive or diamond blade to cut along wafer streets and separate the wafer into individual dies.
Application
Used for conventional blade dicing with controlled spindle speed, feed, blade condition, cooling and cut depth to minimize kerf loss, chipping, cracks and other edge damage while maintaining throughput.
Related search terms
Wafer saw; blade dicer; die saw
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Related concepts
Evidence and further reading
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/singulation-the-moment-when-a-wafer-is-separated-into-multiple-semiconductor-chips/
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/semiconductor-back-end-process-episode-6-conventional-packages/