Definition
A semiconductor assembly operation that secures a die to a leadframe, package substrate or other mounting surface using a material or process that provides the required mechanical bond and, where needed, thermal or electrical conduction.
Application
Used in conventional and power-device packaging with solders, sintered materials, adhesives or other attach systems; bondline thickness, voiding, thermal path, electrical path, stress and reliability are controlled for the package application.
Related search terms
Die attachment; chip attach
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Related concepts
Evidence and further reading
- Evidence from indium.comhttps://www.indium.com/applications/semiconductor-packaging-and-assembly/die-attach/
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/die-bonding-process-for-placing-a-chip-on-a-package-substrate/