Quad Flat No-Lead

14 Packaging, Assembly, Chiplets & 3D Integration

Notation QFN

Definition

Quad flat no-lead (QFN) is a low-profile leadframe-based integrated-circuit package with no leads protruding beyond the package body; electrical contact pads are exposed on the bottom perimeter and many versions include an exposed die paddle for thermal and electrical connection.

Application

Used for compact surface-mount IC packaging where small footprint, short electrical interconnects, and efficient heat transfer are desirable; the package is assembled to a PCB through its bottom pads and exposed paddle when present.

Related search terms

Quad-flat no-lead; Quad flat no lead package

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