Definition
An electrical interconnection process that bonds metal wire to contact pads, using methods such as ball bonding or wedge bonding.
Application
Used in semiconductor assembly to connect die pads to package leads or substrates.
Related concepts
Evidence and further reading
- Evidence from kns.comhttps://www.kns.com/products-services/ball-bonding
- Evidence from palomartechnologies.comhttps://www.palomartechnologies.com/processes/wire-bonding/wedge