Definition
A defined metallized area on an integrated-circuit die designed to provide a robust electrical and mechanical interface for probing, wire bonding, bumping or other package-level interconnection.
Application
Used to connect die circuitry to package leads, substrates or external interconnect structures; pad metallurgy and underlying dielectric/mechanical support affect bond reliability, while pad opening and pitch are interconnection design constraints.
Related search terms
Wire-bond pad; die bond pad
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Related concepts
Evidence and further reading
- Evidence from onsemi.comhttps://www.onsemi.com/site/pdf/UseofHarshWaferProbingtoEvaluateVariousBondPadStructures.pdf
- Evidence from asekh.aseglobal.comhttps://asekh.aseglobal.com/products-services/technology.html