Definition
A metallization layer or stack between a semiconductor die pad and an interconnect bump that provides an electrical and mechanical interface.
Application
Supports solder-bump attachment in flip-chip and wafer-level packages; typical stacks provide adhesion, diffusion control and a solder-wettable surface.
Related search terms
Under-Bump Metallurgy
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from patents.google.comhttps://patents.google.com/patent/US7064446B2/en
- Evidence from amkor.comhttps://amkor.com/packaging/wafer-level-packaging/wlcsp/