Definition
A packaging/interconnect method in which a die is mounted active-side down and connected to a substrate through an area array of bumps or direct-bond structures rather than perimeter wire bonds.
Application
Used for high-I/O processors, accelerators, RF devices, and advanced packages to shorten interconnects and improve electrical, thermal, and I/O-density performance.
Related search terms
Flip Chip; FC
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Related concepts
Evidence and further reading
- Evidence from technav.ieee.orghttps://technav.ieee.org/topic/flip-chip/
- Evidence from ibm.comhttps://www.ibm.com/it-it/services/semiconductor-assembly-test