Definition
A raised conductive interconnect structure formed on a die or wafer pad so the chip can make a short vertical electrical and mechanical connection to a package substrate, interposer or another die.
Application
Used in flip-chip and wafer-level packaging to replace or complement wire bonds. Common bump structures include solder bumps and copper pillars, and finer bump geometries support higher I/O density.
Related search terms
Flip-chip bump; wafer bump
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/bumping-services/
- Evidence from amkor.comhttps://amkor.com/packaging/laminate/fccsp/