Definition
A raised solder interconnect on a die or package pad that forms an electrical joint to a mating surface during assembly.
Application
Connects dies to package carriers in flip-chip assembly and provides external interconnections in wafer-level packages.
Related concepts
Evidence and further reading
- Evidence from amkormarcomexternal.blob.core.windows.nethttps://amkormarcomexternal.blob.core.windows.net/amkordotcom/wp-content/uploads/2018/02/Flip_Chip_TS102.pdf
- Evidence from research.ibm.comhttps://research.ibm.com/publications/pb-free-micro-joints-50-mm-pitch-for-the-next-generation-micro-systems-the-fabrication-assembly-and-characterization