Definition
Packaging of multiple semiconductor dies through processing in wafer format, on an original device wafer or a reconstituted wafer.
Application
Used to make compact fan-in and fan-out packages and integrate multiple dies within a package.
Related concepts
Evidence and further reading
- Evidence from imec-int.comhttps://www.imec-int.com/en/imec-magazine/imec-magazine-june-2019/a-new-approach-to-fan-out-wafer-level-packaging
- Evidence from amkor.comhttps://amkor.com/packaging/wafer-level-packaging/wlfo-2/