Definition
Fan-out wafer-level packaging (FOWLP) is a wafer-level packaging approach in which singulated dies are embedded or reconstituted into a larger wafer-format structure and redistribution layers route connections beyond the original die footprint, enabling increased I/O density without a conventional package substrate in basic fan-out forms.
Application
FOWLP is used to build thin, high-density packages and heterogeneous multi-die integrations with short redistribution-layer interconnects, supporting mobile, networking, and advanced system-in-package applications.
Related search terms
FOWLP; fan-out WLP; wafer-level fan-out
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Related concepts
Evidence and further reading
- Evidence from amkor.comhttps://amkor.com/packaging/wafer-level-packaging/wlfo-2/
- Evidence from amkor.comhttps://amkor.com/technology/swift/