Definition
A plated vertical copper post used as a fine-pitch flip-chip interconnect, often finished with a solder cap or other terminal metallization for attachment to a substrate or another package structure.
Application
Used where fine pitch, high I/O density, stable stand-off height and high current capability are required. Copper pillars are common in mobile, ASIC, processor and advanced-package flip-chip applications.
Related search terms
Cu pillar; copper-pillar bump
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Related concepts
Evidence and further reading
- Evidence from amkor.comhttps://amkor.com/technology/copper-pillar/
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/bumping-services/