Die-to-Die Interface

14 Packaging, Assembly, Chiplets & 3D Integration

Notation D2D (common shorthand)

Definition

The physical and electrical connection between separate dies or chiplets in a package, including the signaling lanes and interface functions that allow data and control information to pass from one die to another.

Application

Used in multi-die and chiplet systems to provide short-reach, high-bandwidth, power-efficient communication; standardized interfaces such as UCIe define physical-layer and protocol requirements that support interoperability between chiplets.

Related search terms

Die-to-die interconnect; chiplet interface

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Related concepts

Evidence and further reading