Definition
The integration and electrical interconnection of two or more semiconductor dies within a common package or tightly integrated system, either side-by-side or vertically stacked.
Application
Used in advanced packaging to combine heterogeneous logic, memory, I/O, analog, RF, or accelerator dies while improving density, bandwidth, modularity, or yield economics.
Related search terms
multi-die packaging
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Related concepts
Evidence and further reading
- Evidence from intel.comhttps://www.intel.com/content/www/us/en/newsroom/tech101/explaining-common-chip-terms.html
- Evidence from intel.comhttps://www.intel.com/content/www/us/en/foundry/packaging.html