Definition
A relatively small functional die designed to be integrated with other dies in the same package so multiple chiplets can collectively implement a larger system.
Application
Used in heterogeneous integration to mix logic, memory, I/O or accelerator dies from compatible processes, enabling modular product construction, reuse and package-level scaling beyond single-die reticle limits.
Related search terms
Chiplet die; modular die
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Related concepts
Evidence and further reading
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