Definition
A material property describing the fractional change in a dimension per unit change in temperature over a specified temperature range.
Application
Used in semiconductor packaging and thin-film integration to predict thermomechanical stress, warpage and fatigue caused by CTE mismatch among silicon, substrates, metals, molding compounds, underfills and other package materials.
Related search terms
Thermal expansion coefficient
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Related concepts
Evidence and further reading
- Evidence from nist.govhttps://www.nist.gov/publications/nist-recommended-practice-guide-capacitance-cell-measurement-out-plane-expansion-thin
- Evidence from pages.nist.govhttps://pages.nist.gov/CHIPS-AWACKSM-data/web/index.html