Definition
Temperature-induced mechanical stress arising when thermal expansion or contraction is constrained, including by temperature gradients or mismatched expansion of joined materials.
Application
Analyzed in semiconductor packages to locate stress concentrations and assess risks of cracking or delamination.
Related concepts
Evidence and further reading
- Evidence from catalogimages.wiley.comhttps://catalogimages.wiley.com/images/db/pdf/9780470627693.excerpt.pdf
- Evidence from metallurgy.nist.govhttps://www.metallurgy.nist.gov/techactv1995/stresspack.html