Definition
A reliability stress test that repeatedly exposes devices or assemblies to specified low and high temperatures.
Application
Used to assess semiconductor-package and interconnect reliability under repeated temperature changes.
Related concepts
Evidence and further reading
- Evidence from ti.comhttps://www.ti.com/quality-reliability/reliability/testing.html
- Evidence from nepp.nasa.govhttps://nepp.nasa.gov/DocUploads/99810235-C28A-4A8D-BD52223A33EF7CDF/ASME-Hawaii993-lockeed.pdf