Test, Reliability, Yield & Failure Analysis
Browse 49 glossary entries in Test, Reliability, Yield & Failure Analysis. Open a term for its definition, application, related concepts and evidence.
49 entries
- Accelerated Life Test
- Arrhenius Model
- Automatic Test Equipment
- Bias Temperature Instability
- Black's Equation
- Boundary Scan
- Built-In Self-Test
- Burn-In
- Defect-Limited Yield
- Design for Test
- Dielectric Breakdown
- Electrical Failure Analysis
- Failure Analysis
- Failure Mechanism
- Failure Mode and Effects Analysis
- Failure Rate
- Final Test
- Focused Ion Beam
- Functional Test
- High-Temperature Operating Life
- Highly Accelerated Stress Test
- Hot Carrier Injection
- Interface Trap
- Junction Leakage
- Mean Time Between Failures
- Negative Bias Temperature Instability
- Parametric Test
- Physical Failure Analysis
- Positive Bias Temperature Instability
- Probe Card
- Probe Station
- Process Excursion
- Process Margin
- Qualification
- Reliability
- Root Cause Analysis
- Scan Chain
- Single-Event Upset
- Soft Error
- Temperature Cycling
- Thermal Shock
- Wafer Probe
- Wafer Sort
- Wafer Yield
- Weibull Analysis
- Yield
- Yield Learning
- Yield Management
- Yield Ramp
Continue learning with PTI
Related PTI training covers the following parts of this topic. See each course outline for its scope.
- Semiconductor Yield Management
Yield analysis, wafer sort, parametric testing, screening and reliability.
- Failure Analysis & Root Cause Engineering
Failure analysis workflow, physical characterization and root-cause investigation.