Definition
In device reliability testing, sudden exposure to large changes in temperature, often repeated between hot and cold extremes.
Application
Used to assess device robustness and thermal-expansion-mismatch weaknesses, including solder-joint cracking and interface delamination in electronic assemblies.
Related concepts
Evidence and further reading
- Evidence from jedec.orghttps://www.jedec.org/standards-documents/docs/jesd-22-a106b
- Evidence from calce.umd.eduhttps://calce.umd.edu/thermal-shock