Failure Analysis

13 Test, Reliability, Yield & Failure Analysis

Notation FA

Definition

Failure analysis is the systematic investigation of a failed semiconductor device, package, structure, or test result to identify the physical or electrical failure mode and determine the underlying root cause or contributing mechanisms.

Application

Semiconductor failure analysis combines electrical characterization with physical inspection and material/structural analysis to localize defects, distinguish competing failure modes, and feed corrective action back into design, process, packaging, or reliability controls.

Related search terms

Semiconductor failure analysis; device failure analysis

Search phrases help you find this entry; their meaning depends on the context shown here.

Related concepts

Evidence and further reading

  • Evidence from nist.govhttps://www.nist.gov/publications/detailed-failure-analysis-examination-effect-thermal-cycling-cu-tsv-reliability
  • Evidence from nist.govhttps://www.nist.gov/publications/reliability-and-characterization-challenges-nano-scale-electronic-devices

Continue learning with PTI