Definition
A systematic investigation that combines semiconductor test, manufacturing, design, and failure-analysis evidence to identify underlying causes of device failures or yield loss.
Application
Used to guide corrective design or manufacturing changes by relating observed electrical failures, physical anomalies, and production-test results to their underlying causes.
Related search terms
Root-cause analysis
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Related concepts
Evidence and further reading
- Evidence from ti.comhttps://www.ti.com/quality-reliability/faqs/failure-analysis.html
- Evidence from synopsys.comhttps://www.synopsys.com/content/dam/synopsys/solutions/slm/datasheets/silicon-timing-failure-rca-ds.pdf