Definition
A semi-empirical reliability relation that estimates interconnect mean time to failure from current density, absolute temperature, activation energy and fitted material/process constants.
Application
Used to accelerate and extrapolate electromigration reliability testing for on-chip and package interconnects, comparing how current density and temperature affect expected lifetime.
Related search terms
Black equation; electromigration lifetime equation
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Related concepts
Evidence and further reading
- Evidence from technav.ieee.orghttps://technav.ieee.org/topic/interconnect-reliability/
- Evidence from ansyshelp.ansys.comhttps://ansyshelp.ansys.com/public/Views/Secured/Electronics/v252/en/Subsystems/SIwave/Content/ComputingEMMTTFSimulations.htm