Definition
In wafer-fabrication accounting, the fraction of starting wafers that complete fabrication and remain available for electrical die sorting.
Application
Used to track wafer losses from breakage or misprocessing and assess fabrication productivity.
Related concepts
Evidence and further reading
- Evidence from ocw.mit.eduhttps://ocw.mit.edu/courses/6-780-semiconductor-manufacturing-spring-2003/18850083d59c9da48510d86e38c8e79c_ps6sol.pdf
- Evidence from ieor.berkeley.eduhttps://ieor.berkeley.edu/wp-content/uploads/2019/10/CSM-52.pdf