Definition
Electrical testing and binning of dies while they remain on a wafer to identify units that meet or fail test criteria.
Application
Screens out noncompliant dies and collects wafer-level yield and performance data.
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Evidence and further reading
- Evidence from cdrdv2-public.intel.comhttps://cdrdv2-public.intel.com/837950/Quality%20Volume%207%20-%20Test%20Coverage%20for%20Quality.pdf
- Evidence from swtest.orghttps://www.swtest.org/swtw_library/2007proc/PDF/T00_01_Broz_SWTW2007.pdf