Definition
Physical failure analysis is the physical and materials-characterization portion of semiconductor failure analysis used to localize, expose, image, and characterize defects in devices or packages.
Application
Used for root-cause analysis through techniques such as delayering, cross-sectioning, SEM/TEM imaging, nanoprobing, and site-specific sample preparation after electrical or defect localization.
Related concepts
Evidence and further reading
- Evidence from thermofisher.comhttps://www.thermofisher.com/fr/fr/home/semiconductors/defect-localization.html
- Evidence from thermofisher.comhttps://www.thermofisher.com/ht/en/home/about-us/events/industrial/helios-5-pfib-webinar.html