Definition
Out-of-plane deformation of a semiconductor package, substrate, or assembly.
Application
Characterized over temperature and modeled during package development to assess deformation and solder-joint reliability.
Related concepts
Evidence and further reading
- Evidence from akrometrix.comhttps://akrometrix.com/measurement-vision-technologies/
- Evidence from ti.comhttps://www.ti.com/lit/ug/spru811a/spru811a.pdf