Definition
A polymeric material occupying space beneath an attached die or package around its interconnects to reinforce the assembly.
Application
Reduces thermomechanical stress on flip-chip solder joints and reinforces board-mounted packages such as ball-grid arrays.
Related concepts
Evidence and further reading
- Evidence from tms.orghttps://www.tms.org/pubs/journals/JOM/9903/Frear-9903.html
- Evidence from dm.henkel-dam.comhttps://dm.henkel-dam.com/is/content/henkel/lt-8332-brochure-board-level-underfills-and-encapsulants