Definition
A reserved region between neighboring dies on a wafer that provides space for cutting the wafer into separate dies.
Application
Provides the dicing path and can also accommodate process-control test structures used to assess wafer fabrication before separation.
Related search terms
scribe line; saw lane
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Related concepts
Evidence and further reading
- Evidence from news.skhynix.comhttps://news.skhynix.com/en/semiconductor-back-end-process-episode-6-conventional-packages/
- Evidence from repository.tudelft.nlhttps://repository.tudelft.nl/file/File_872cce8c-9aa5-48aa-826b-1383e161195c