Definition
A high-density package substrate that provides electrical routing, power distribution, mechanical support and board-level connection for advanced multi-die semiconductor packages.
Application
Used beneath chiplets, fan-out modules and other advanced packages to fan out I/O, connect the package to the PCB and support large high-I/O-count AI or HPC assemblies.
Related search terms
High-density package substrate
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Related concepts
Evidence and further reading
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/blog/technology/advanced-packaging-design-for-heterogeneous-integration/
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/focos/