Definition
An integrated-circuit package whose board-level terminals are arranged as a two-dimensional array of solder balls on the underside of the package.
Application
Used for packages requiring high I/O density and good electrical or thermal performance, with solder balls connecting the package substrate to the printed circuit board during reflow assembly.
Related search terms
Ball-grid-array package
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Related concepts
Evidence and further reading
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/wire-bond-bga/
- Evidence from asekh.aseglobal.comhttps://asekh.aseglobal.com/products-services/wire-bond.html