Definition
A controlled thermal cycle that heats solder above its liquidus so solder deposits or bumps melt and coalesce, then cools them to form solid interconnections.
Application
Used in semiconductor packaging and electronics assembly for solder-bump or component attachment; the time-temperature profile controls wetting, coalescence, and defect risk.
Related search terms
Solder reflow
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Related concepts
Evidence and further reading
- Evidence from indium.comhttps://www.indium.com/blog/matching-a-reflow-profile-to-a-solder-paste-spec/
- Evidence from macdermidalpha.comhttps://www.macdermidalpha.com/products/circuit-board-assembly/surface-mount-technology/solder-pastes/alpha-om-5100-solder-paste