Definition
The back-end manufacturing operations that convert fabricated dies into usable semiconductor packages by attaching, interconnecting, protecting and completing the packaged device.
Application
Includes processes such as die attach, wire bonding or flip-chip interconnection, molding or encapsulation, package finishing and related handling before final product test and shipment.
Related search terms
Semiconductor assembly; IC assembly
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Related concepts
Evidence and further reading
- Evidence from amkor.comhttps://amkor.com/technology/3d-stacked-die/
- Evidence from asekh.aseglobal.comhttps://asekh.aseglobal.com/products-services/package.html