Definition
A semiconductor-packaging process that surrounds or covers the die and interconnect structure with a protective material, commonly an epoxy mold compound, to provide mechanical and environmental protection.
Application
Used in molded and advanced packages to protect dies and wire or package interconnects from moisture, contamination and mechanical damage while supporting package handling and reliability requirements.
Related search terms
Semiconductor encapsulation; mold encapsulation; package encapsulation
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from amkor.comhttps://amkor.com/blog/will-an-adhesion-promoter-prevent-delamination-in-power-semiconductor-packages/
- Evidence from amkor.comhttps://amkor.com/blog/qualifying-exposedpad-tqfp-for-aec-q006-grade-0/