Definition
A thermosetting semiconductor encapsulation material, commonly epoxy-resin based with inorganic filler and functional additives, molded around a device or package for mechanical and environmental protection and electrical insulation.
Application
Used to encapsulate semiconductor packages, protect die and interconnects from handling and environment, and support package mechanical integrity.
Related search terms
epoxy molding compound; EMC
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Related concepts
Evidence and further reading
- Evidence from semiconductors.orghttps://www.semiconductors.org/wp-content/uploads/2018/06/SD-AO-Exhibit-C-May-14-2013.pdf
- Evidence from sumibe.co.jphttps://www.sumibe.co.jp/english/product/hpp/molding-compound/thermosetting/index.html