Definition
An industry rating for moisture-sensitive packaged electronic devices that specifies allowable exposure to ambient conditions before solder reflow under defined temperature and humidity conditions.
Application
Used to set dry-pack, floor-life, baking, storage, and handling controls that prevent moisture-driven delamination, cracking, or 'popcorn' damage during reflow.
Related search terms
moisture/reflow sensitivity level
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Related concepts
Evidence and further reading
- Evidence from analog.comhttps://www.analog.com/en/resources/glossary/moisture_sensitivity_level-msl.html
- Evidence from cosel.comhttps://www.cosel.com/en/contact/product/faq/a0073.html