Definition
In semiconductor packaging, a molding process that forces flowable encapsulant from a mold pot into closed cavities around the assemblies.
Application
Used to encapsulate wire-bonded dies on leadframes in resin during package assembly.
Related concepts
Evidence and further reading
- Evidence from towajapan.co.jphttps://www.towajapan.co.jp/en/technology/molding/
- Evidence from patents.justia.comhttps://patents.justia.com/patent/20020153637