Definition
Adeia's patented Direct Bond Interconnect (DBI®) hybrid-bonding technology, in which prepared dielectric surfaces bond directly and embedded metal pads form fine-pitch electrical interconnects without conventional solder bumps or adhesive underfill.
Application
Used for wafer-to-wafer, die-to-wafer and die-to-die 3D integration to create very fine-pitch copper interconnects with low-profile stacks and reduced interconnect parasitics; CMP, surface activation, alignment and thermal treatment are key process elements.
Related search terms
DBI hybrid bonding; Direct Bond Interconnect technology
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Related concepts
Evidence and further reading
- Evidence from adeia.comhttps://adeia.com/semiconductor/direct-bond-interconnect
- Evidence from adeia.comhttps://adeia.com/semiconductor/inventing-connections-for-humanity