Definition
An interposer that uses redistribution-layer routing, commonly polymer dielectric and copper traces, to provide package-level electrical interconnection between integrated dies.
Application
Used in heterogeneous and 2.5D advanced packaging to fan out and route fine-pitch connections among devices such as system-on-chip dies and high-bandwidth memory.
Related search terms
Redistribution-layer interposer
Search phrases help you find this entry; their meaning depends on the context shown here.
Related concepts
Evidence and further reading
- Evidence from 3dfabric.tsmc.comhttps://3dfabric.tsmc.com/english/dedicatedFoundry/technology/cowos.htm
- Evidence from amkor.comhttps://amkor.com/packaging/wafer-level-packaging/wlcsp/