Definition
An electrochemical deposition process used at wafer level to build metallic bump structures, such as solder bumps or copper pillars, on prepared pad and under-bump-metallization regions.
Application
Used for high-I/O-count and fine-pitch flip-chip packaging because plating can build controlled bump height and composition across many die sites before wafer singulation.
Related search terms
Electroplated wafer bumping; bump electroplating
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Related concepts
Evidence and further reading
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/press-room/ase-completes-internal-development-of-electroplated-wafer-bumping-technology/
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/bumping-services/