Definition
An advanced-packaging approach in which two or more active dies are placed side by side and interconnected through a high-density interposer or redistribution-layer structure rather than being stacked directly on top of one another.
Application
Used to integrate logic, chiplets and high-bandwidth memory in AI and high-performance-computing packages while providing much denser die-to-die routing than a conventional package substrate alone.
Related search terms
2.5D IC; 2.5D packaging
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Related concepts
Evidence and further reading
- Evidence from ase.aseglobal.comhttps://ase.aseglobal.com/3d-ic-packaging/
- Evidence from 3dfabric.tsmc.comhttps://3dfabric.tsmc.com/english/dedicatedFoundry/technology/cowos.htm