Definition
Package-on-package is an advanced packaging arrangement in which one completed semiconductor package is vertically stacked on another package.
Application
Used to increase integration density, commonly by stacking memory above a logic or application-processor package in space-constrained products.
Related concepts
Evidence and further reading
- Evidence from semiconductor.samsung.comhttps://semiconductor.samsung.com/news-events/tech-blog/introducing-a-new-package-architecture-for-improved-thermal-efficiency-in-mobile-application-processors/
- Evidence from intel.comhttps://www.intel.com/content/www/us/en/newsroom/news/reinventing-chip-design-outside-in.html